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This model adopts high-power infrared picosecond laser cutting and CO2 laser splitting technology, and self-developed glass cutting head. Integrated design of front cutting and back cracking, reducing manual operation steps and improving production efficiency

This model adopts high-power infrared picosecond laser cutting and CO2 laser splitting technology, and self-developed glass cutting head. Integrated design of front cutting and back cracking, reducing manual operation steps and improving production efficiency;

This model adopts a high-power nanosecond green light or infrared MOPA laser, a 2.5D high-speed and high-precision galvanometer, automatic focusing and layer by layer scanning, which can quickly and accurately drill holes.