Industry

solution

Nowadays, a large number of wafers for chips use monocrystalline silicon, polycrystalline silicon, silicon carbide, and other substrate materials. Wafer laser cutting machines can be used for wafer modification and drilling, improving processing efficiency and material utilization.

The PCB industry has evolved from traditional fiberglass panels (green boards) to medium to high power copper aluminum substrates, and now to high-strength, high thermal conductivity, and high-pressure resistant new ceramic substrates. The cutting, punching, and scoring inside all require high-precision and efficient laser processing.

Ceramic backboards and panels for 3C products such as mobile phones and watches; Semiconductor equipment specific ceramic devices; Special applications in various industries such as solar photovoltaic and new energy vehicles.

Including various protective lenses, reflectors, lenses and other optical lenses in the laser industry, as well as glass panels and decorations required for household appliances and home construction.

Solar photovoltaic, new energy vehicles, hydrogen fuel cells, energy storage and other industries

New material laboratories, laser applications, mechanical processing, new energy laboratories, etc. in various universities