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Online Inquiry
|
序号 |
项 目 |
参 数 |
|
1 |
Laser wavelength |
1060-1080nm |
|
2 |
Laser output power |
150W定制可选 |
|
3 |
Max.cutting range |
400*400mm |
|
4 |
Cutting thickness |
0.2-2mm（视材料不同） |
|
5 |
Precision of repeated positioning of X/Y axis |
±3um |
|
6 |
Processing speed |
0-3000mm/min |
|
7 |
Maximum distance speed |
60m/min |
|
8 |
Maximum acceleration |
1.0G |
|
9 |
Worktable precision |
≦0.015mm |
|
10 |
Transmission mode |
直线电机+0.1um光栅尺 Imported linear motor +0.1um grating ruler |
|
11 |
Whole machine power (no fan) |
≦6KW |
|
12 |
Total weight of the whole machine |
约（about）2000KG |
|
13 |
External dimension(length*width*height) |
1500*1600*1800mm （以实物为准） |
This model adopts the most advanced semiconductor fiber laser in the world. The beam quality is good, the volume is small, and the photoelectric conversion efficiency is high. Long term use, maintenance free, low cost, low power consumption and other advantages
Advantage
- This model adopts the most advanced semiconductor fiber laser in the world. The beam quality is good, the volume is small, and the photoelectric conversion efficiency is high. Long term use, maintenance free, low cost, low power consumption and other advantages；
- Adopting marble precision platform and XY separated closed structure, it has good rigidity, shock resistance, and high-speed stability
- It adopts magnetic suspension imported linear motor, 0.1um high-precision grating ruler and full closed-loop bus CNC system, which has high response speed, high precision and low maintenance rate;
- Mainly used for cutting and punching various wafer substrate materials such as monocrystalline silicon, polycrystalline silicon, and silicon carbide.
- Combined with CCD visual positioning system, it can also be used for cutting and marking of metalized ceramics and ceramic substrates.
Application
- Semiconductor chip industry: wafer cutting, punching, and wafer modification.
- PCB industry: ceramic circuit board cutting, drilling and marking.
- 3C industry: various ceramic substrates, mobile phone ceramic backboard, middle frame, wearing digital products, etc
- New energy industry: ceramic devices such as solar photovoltaic equipment, automotive sensors, hydrogen fuel cells, etc.
Parameter
Sample
-
Wafer cutting and punching -
Wafer resizing -
SI3N4 drilling micropores -
Ceramic thick film circuit